Wafer Bonding Equipment Market Share 2023-2029
The global Wafer Bonding Equipment market was valued at US$ 316.7 million in 2022 and is projected to reach US$ 461 million by 2029, at a CAGR of 5.5% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
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Wafer bonding equipment is a type of semiconductor processing equipment used to bond two or more wafers together to form a single structure. This process is typically used to create complex semiconductor devices that require multiple layers or different materials.
Wafer bonding can be achieved through various techniques, including thermal compression bonding, adhesive bonding, and direct bonding. The choice of bonding technique depends on the materials being bonded, the required bonding strength, and the desired level of precision.
The equipment used for wafer bonding typically includes a bonding chamber or tool, which provides a controlled environment for the bonding process. The bonding surfaces of the wafers are carefully cleaned and prepared to ensure a strong and uniform bond. The wafers are then aligned and brought into contact with each other under controlled pressure and temperature conditions.
Total Market by Segment:
Global Wafer Bonding Equipment Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (Units)
Global Wafer Bonding Equipment Market Segment Percentages, by Type, 2022 (%)
- Fully Automatic
- Semi Automatic
Further, the report presents profiles of competitors in the market, key players include:
- EV Group
- SUSS MicroTec
- Tokyo Electron
- Applied Microengineering
- Nidec Machinetool
- Ayumi Industry
- Shanghai Micro Electronics
- U-Precision Tech
- Hutem
- Canon
- Bondtech
- TAZMO
- TOK
- Kulicke & Soffa
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