Vacuum Wafer Chucks Market Share 2023-2029

Vacuum Wafer Chucks Market Share 2023-2029

Aug 30, 2023

The global Vacuum Wafer Chucks market was valued at US$ 187.7 million in 2022 and is projected to reach US$ 275 million by 2029, at a CAGR of 5.6% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.


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Wafer Chucks include two type, electrostatic chuck and Vacuum Wafer Chucks. The vacuum chucks are used in the semiconductor industry to accurately position the wafer in the machine. Vacuum Wafer Chuck is mainly used for semiconductor dicing, grinding and washing etc.


The Vacuum Wafer Chucks Market is a sector that involves the manufacturing and sale of vacuum wafer chucks. These chucks are devices that are used in the semiconductor industry for securely holding and positioning silicon wafers during various manufacturing processes like deposition, etching, and inspection.


The growth of the semiconductor industry, which has been fueled by increasing demand for smaller and more powerful devices, is a significant driver of the vacuum wafer chucks market. Vacuum wafer chucks play a critical role in ensuring the accuracy and precision of semiconductor manufacturing, which is vital to the performance of these devices.


Total Market by Segment:

Global Vacuum Wafer Chucks Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)

Global Vacuum Wafer Chucks Market Segment Percentages, by Type, 2022 (%)

  • 300 mm Wafer
  • 200 mm Wafer
  • Others



Further, the report presents profiles of competitors in the market, key players include:

  • Disco
  • NTK CERATEC CO., LTD.
  • Tokyo Seimitsu
  • Kyocera
  • KINIK Company
  • Cepheus Technology Ltd.
  • Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
  • SemiXicon
  • MACTECH
  • RPS Co., Ltd.
  • SHINKAWA Ltd.
  • TOTO Ltd.
  • ACCRETECH
  • FINE SODA Co. Ltd.
  • NGK Insulators Ltd.
  • SCREEN Semiconductor Solutions Co. Ltd.
  • SEIKO NPC Corporation
  • KASUGA DENKI CORPORATION


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