Flip Chip  Market Size  2023-2029

Flip Chip  Market Size  2023-2029

Sep 30, 2023

The global Flip Chip market was valued at US$ 12440 million in 2022 and is projected to reach US$ 19100 million by 2029, at a CAGR of 6.3% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.


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Flip Chip is a semiconductor packaging technology that involves directly mounting a microchip or a die onto a substrate or a printed circuit board (PCB) without the use of wires or leads.


In this process, the face of the chip is flipped over so that its active side faces down, and the connections are made through small bumps, or solder balls, that are placed on the chip’s contact pads. The bumps are then aligned and bonded to matching pads on the substrate or PCB, forming a direct electrical connection between the chip and the board.


Flip Chip technology offers advantages over traditional wire-bonding packaging methods, including higher connection density, faster data transfer, and improved thermal performance. It is widely used in a variety of electronic devices, such as microprocessors, memory chips, and sensors.


Total Market by Segment:

Global Flip Chip Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (M Units)
Global Flip Chip Market Segment Percentages, by Type, 2022 (%)

  • FC BGA
  • FC PGA
  • FC LGA
  • FC CSP
  • Others


Further, the report presents profiles of competitors in the market, key players include:

  • Amkor
  • Taiwan Semiconductor Manufacturing
  • ASE Group
  • Intel Corporation
  • JCET Group Co.,Ltd
  • Samsung Group
  • SPIL
  • Powertech Technology
  • Tongfu Microelectronics Co., Ltd
  • HC Semitek
  • SANAN OPTOELECTRONICS CO.,LTD
  • Focus Lightings Tech CO.,LTD.
  • Tianshui Huatian Technology Co., Ltd
  • United Microelectronics Corporation (UMC)
  • Intel Corporation
  • STATS ChipPAC Pte. Ltd.



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