Chip Packaging Trends 2023-2029

Chip Packaging Trends 2023-2029

Sep 01, 2023

The global Chip Packaging market was valued at US$ 32050 million in 2022 and is projected to reach US$ 48900 million by 2029, at a CAGR of 6.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.,Chip%20Packaging%20Market%3A%20Emerging%20Trends%2C%20Technological%20Advancements%2C%20and%20Business%20Strategies%20(2023%2D2029),-The%20global%20Chip

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on

Total Market by Segment:

Global Chip Packaging Market, by Packaging Type, 2018-2023, 2024-2029 ($ millions)

Global Chip Packaging Market Segment Percentages, by Packaging Type, 2022 (%)

  • Ball Grid Array (BGA)
  • Dual Flat No-Leads (DFN)
  • Dual In-Line Memory Module (DIMM)
  • Quad Flat Package (QFP)
  • Small Outline Package (SOP)

Further, the report presents profiles of competitors in the market, key players include:

  • ASE Group
  • Amkor Technology
  • JCET
  • Siliconware Precision Industries
  • STATS ChipPAC Pte. Ltd.
  • Siliconware Precision Industries Co., Ltd
  • Powertech Technology
  • TongFu Microelectronics
  • Tianshui Huatian Technology
  • UTAC
  • Chipbond Technology
  • Hana Micron
  • OSE
  • Walton Advanced Engineering
  • Unisem
  • ChipMOS
  • Signetics
  • Carsem

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